We were founded in 1992 as a Trading Company and distributor of Electronic components. In 1996, we started our fabrication and repacking sub-contracting house in Dongguan. From 2004, we consolidated our name as Emei Group and became a Leading manufacturer and supplier of EMI Gaskets, TIMs, Compounds and Adhesives, Bulk Molding Compounds and Specialty Transformers. We have four Business units with strong R & D and Supporting team in Dongguan, China. We have sales offices and manufacturing facilities in North America, Belgium, Hong Kong, Shanghai, and Taiwan. We have distributors in the USA, Mexico, Europe, the Middle East, and Japan.
• Founded as a Trading Company and built up our network in Electronic Market
Acquired a new 7000 sq ft office in Shatin
• Distributed more than 30 brands
• Achieved ISO 9001 version 2000 Certification
• Became the Preferred Converter of Roger USA
• Acquired over 54000 Sq M Land and to build our own Plant in Dongguan
• Joint Venture Established with BMC Inc USA to manufacture and sales of Bulk Molding Compound
• Set up our 100% own Emei Component Dongguan Limited for Transformer and Coils manufacturing
• Set up our Shanghai and Taiwan office with secondary production facility
• Grand Opening of our 37000 Sq M Emei Plant which can accommodate 1000 workers
• Became a recognized manufacturing brand in Electronic industry – a business partner of Flextronics, Titron, V Tech, Johnson, Truly, Elec & Elteck, Foxconn, Alcatel, IBM, Sanmina. Intel, Cooler Master, GE, Siemens and Whirlpool
• 20th Anniversary Celebration in Dongguan with all the Partners, Government Officials, and our US, Belgium, Taiwan, Shanghai colleagues
• Launched of our Schlegel BandSorb Microwave Absorber
• Launch of Schlegel OpTIM Thermal Product
• Became a Member of Hong Kong Electronics Association
• We were awarded High-tech Enterprise Identification
• Celebrating 30th Anniversary in Electronics Industry
• Obtain IATF 16949 certification
软性线路/薄膜开关
| 典型应用 | 产品 |
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| 产品型号 | 说明 | 特性 | 粘度 cPs @25℃ | 固化条件 |
| CI-1001 | 导电银浆 | 高导电率 | <0.015Ω/□.mil | 120℃ 20分钟 |
| CI-1001B | 导电银浆 | 高导电率、低价版 | <0.015Ω/□.mil | 120℃ 20分钟 |
| CI-1036 | 导电银浆 | 高导电率、高延伸性 | <0.010Ω/□.mil | 110℃ 20分钟 |
| CI-800 | 导电银浆 | 高导电率、耐弯折、附着力好 | <0.015Ω/□.mil | 120℃ 30分钟 |
| CI-801 | 导电银浆 | 超高导电率、细线印刷 | <0.009Ω/□.mil | 130℃ 30分钟 |
| CI-802 | 导电银浆 | 低溫固化 | <0.018Ω/□.mil | 90℃ 30分钟 |
| CI-804 | 导电银浆 | 针对敏感基材、例如PC料 | <0.010Ω/□.mil | 120℃ 30分钟 |
| CI-805 | 导电银浆 | 针对敏感基材、例如PC料、低银含 | <0.010Ω/□.mil | 120℃ 30分钟 |
| CI-2001 | 导电银浆 | 耐磨、保护银线路触点 | <20Ω/□.mil | 110℃ 20分钟 |
| CI-2001XL | 导电银浆 | 低粘度、与CI-2001配合使用 | (不可单独使用) | 110℃ 20分钟 |
| CI-2018 | 导电银浆 | 高粘度、低阻抗、印刷线路用 | <12Ω/□.mil | 120℃ 30分钟 |
| CI-2018H | 导电银浆 | 高粘度、低阻抗、印刷线路用 | <11Ω/□.mil | 120℃ 30分钟 |
| CI-2018L | 导电银浆 | 低粘度、与CI-2018H配合使用 | <50Ω/□.mil | 120℃ 30分钟 |
| CI-2002 | 电热碳浆 | 电热毯用、耐高温 | <50Ω/□.mil | 110℃ 20分钟 |
| CI-2022 | 电热碳浆 | 高阻值、与CI-2002 配合使用 | <20kΩ/□.mil | 110℃ 20分钟 |
| CI-2050 | 导电碳浆 | 压力感应 | <20kΩ/□.mil | 110℃ 10分钟 |
| CB-F1023 | 导电碳浆 | LCD ITO 层导通用 | <15Ω/□.mil | 80℃ 15分钟 |
| DI-7502 | UV固化 绝缘油 | 抗对折性好 | >800V/mil | 750mJ/cm² |
| DI-7502B | UV固化 绝缘油 | 蓝色版本 | >800V/mil | 750mJ/cm² |
| DI-7502C | UV固化 绝缘油 | 透明版本 | >800V/mil | 750mJ/cm² |
| DI-7502LH | UV固化 绝缘油 | 无卤素、浅绿色版本 | >800V/mil | 750mJ/cm² |
| DI-702 | UV固化 绝缘油 | 一般应用、低价版 | >800V/mil | 750mJ/cm² |
| DI-702C | UV固化 绝缘油 | 一般应用、半透明 | >800V/mil | 750mJ/cm² |
| DI-7544 | UV固化 绝缘油 | 耐高温高湿 | >800V/mil | 750mJ/cm² |
| D04-132 | UV固化 隔点油 | 高厚度、作隔层油用 | >800V/mil | 750mJ/cm² |
| DI-701 | 热固化 绝缘油、綠色 | 一般应用、低价版 | >800V/mil | 130℃ 20分钟 |
| DI-701C | 热固化绝缘油、透明 | ITO基材附着力高、不影响银浆导电性 | >800V/mil | 130℃ 20分钟 |
| DA-5100 | LED灯贴片银胶 | 高附着力 | <0.0006 Ω.cm | 130℃ 90分钟 |
| EC-9519 | LED灯盖封透镜胶 | UV 固化、 低应力、低硬度50D | >800V/mil | 750mJ/cm² |