We were founded in 1992 as a Trading Company and distributor of Electronic components. In 1996, we started our fabrication and repacking sub-contracting house in Dongguan. From 2004, we consolidated our name as Emei Group and became a Leading manufacturer and supplier of EMI Gaskets, TIMs, Compounds and Adhesives, Bulk Molding Compounds and Specialty Transformers. We have four Business units with strong R & D and Supporting team in Dongguan, China. We have sales offices and manufacturing facilities in North America, Belgium, Hong Kong, Shanghai, and Taiwan. We have distributors in the USA, Mexico, Europe, the Middle East, and Japan.
• Founded as a Trading Company and built up our network in Electronic Market
Acquired a new 7000 sq ft office in Shatin
• Distributed more than 30 brands
• Achieved ISO 9001 version 2000 Certification
• Became the Preferred Converter of Roger USA
• Acquired over 54000 Sq M Land and to build our own Plant in Dongguan
• Joint Venture Established with BMC Inc USA to manufacture and sales of Bulk Molding Compound
• Set up our 100% own Emei Component Dongguan Limited for Transformer and Coils manufacturing
• Set up our Shanghai and Taiwan office with secondary production facility
• Grand Opening of our 37000 Sq M Emei Plant which can accommodate 1000 workers
• Became a recognized manufacturing brand in Electronic industry – a business partner of Flextronics, Titron, V Tech, Johnson, Truly, Elec & Elteck, Foxconn, Alcatel, IBM, Sanmina. Intel, Cooler Master, GE, Siemens and Whirlpool
• 20th Anniversary Celebration in Dongguan with all the Partners, Government Officials, and our US, Belgium, Taiwan, Shanghai colleagues
• Launched of our Schlegel BandSorb Microwave Absorber
• Launch of Schlegel OpTIM Thermal Product
• Became a Member of Hong Kong Electronics Association
• We were awarded High-tech Enterprise Identification
• Celebrating 30th Anniversary in Electronics Industry
• Obtain IATF 16949 certification
DynaGreen® / DynaShear Gaskets
Schlegel Electronic Materials, Inc. introduces DynaGreen® / DynaShear: an innovative EMI shielding gasket family for the shielding of modules in card/cages environment that is able to offer superior features over metal fingerstocks and current Fabric-Over-Foam gaskets. DynaGreen® / DynaShear utilizes the, now famous and efficient, bump technology. DynaGreen® is a halogen-free version of DynaShear which is in compliance with IEC 61249-2-21 (<=900 ppm Bromine and 1500 ppm max for both).
DynaGreen® / DynaShear Currently Features:
-Excellent compression load/deflection ratio due to low memory ultra-soft foam formulation.
-High level of shielding effectiveness even when submitted to large compression variations.
-Highly flexible abrasion resistant conductive fabrics.
| Height Width | 1.5mm | 2.0mm | 2.3mm | 2.7mm | 3.0mm | 3.3mm | 3.5mm | 3.8mm |
| 6mm | EY37n2Zxxxx(HF) | EK97n2Zxxxx(HF) | EQ67n2Zxxxx(HF) | EQ77n2Zxxxx(HF) | E2S7n2Zxxxx(HF) | EQ87n2Zxxxx(HF) | E2W7n2Zxxxx(HF) | EQ97n2Zxxxx(HF) |
| 8mm | EY47n2Zxxxx(HF) | EV37n2Zxxxx(HF) | EP17n2Zxxxx(HF) | EU87n2Zxxxx(HF) | E2T7n2Zxxxx(HF) | EV67n2Zxxxx(HF) | E2X7n2Zxxxx(HF) | EV77n2Zxxxx(HF) |
| 10mm | EY57n2Zxxxx(HF) | EJ87n2Zxxxx(HF) | EJ97n2Zxxxx(HF) | EK17n2Zxxxx(HF) | E2P7n2Zxxxx(HF) | EK27n2Zxxxx(HF) | E2R7n2Zxxxx(HF) | EK37n2Zxxxx(HF) |
| 12.7mm | EY27n2Zxxxx(HF) | EK47n2Zxxxx(HF) | EK57n2Zxxxx(HF) | EK67n2Zxxxx(HF) | E2U7n2Zxxxx(HF) | EK77n2Zxxxx(HF) | E2Y7n2Zxxxx(HF) | EK87n2Zxxxx(HF) |
| 17mm | EY67n2Zxxxx(HF) | EY77n2Zxxxx(HF) | EV87n2Zxxxx(HF) | EY87n2Zxxxx(HF) | E2V7n2Zxxxx(HF) | EY97n2Zxxxx(HF) | E3B7n2Zxxxx(HF) | E1A7n2Zxxxx(HF) |
n: specifies the fabric type (3: NiCu-C70, 4:NiCu-C12) xxxx:specifies length in the form xx.xx”
Standard parts supplied with wide release liner, PSA:2 strips of adhesive is standard
Standard Height for uptaped and uncompressed parts.
All DynaGreen® gaskets have the identical physical and electronic characteristics as DynaShear. DynaGreen® has suffix “HF”. HF : specifies Halogen Free.
eg. : DynaShear: EY37n2Zxxxx
DynaGreen®: EY37n2ZxxxxHF