Emei Group

Emei Group is a supplier of electronic engineering materials and components

Phase Change Materials

Phase Change Materials

Features

  • Proprietary technology prevents excessive pump-out after initial burn-in cycle
  • Naturally tacky and heat sink preheating or additional adhesive for attachment
  • are generally not required
  • Low thermal resistance at low pressures
  • It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated operations


Applications

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • Thermal test stands
  • DC/DC Convertors
  • Memory modules
  • Cache chips
  • IGBTs


Emei PN 
Color 

Thickness
(inch) 

Thermal Conductivity
(W/m-K) 

Phase Change Temperature Range(℃) 
"Burn-in"
Temperature (℃) 
Thermal Impedance @ 10psi/50psi (℃-in2/W) 
Temperature Range(℃) 
E-Phase 800
White0.005-0.02
2.5
50℃
75℃ for 5minutes
0.088 ~ 0.123
-40 ~ 130
E-Phase 7300
Grey0.005-0.02
4.0
55℃
75℃ for 5minutes
0.081 ~ 0.087
-40 ~ 130



ProductColorThickness Range [inch/(mm)]
Thermal Conductivity [W/mk]
Phase Change Temperature [℃]Operation Temperature [℃]
OC-800
White0.005" (0.13) ~ 0.02" (0.50)
2.550-40 ~ 130
OC-7200
Grey0.005" (0.13) ~ 0.02" (0.50)
5.055-40 ~ 120
OC-7300
Grey0.005" (0.13) ~ 0.02" (0.50)
4.055-40 ~ 130
OC-7300 Spec01
Grey0.005" (0.13) ~ 0.02" (0.50)
4.055-40 ~ 130
OC-9100
White0.01” (0.25) ~ 0.02” (0.50)
1.050~65-40 ~ 130
OC-9200
Grey0.01” (0.25) ~ 0.02” (0.50)
4.550~55-40 ~ 130
Applicable to:
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