Emei Group

Emei Group is a supplier of electronic engineering materials and components

Thermal Management Material

Thermal Management Material

Thermal Management Material

Typical applications 
Products 
  • Metal / ceramic adhesion
  • NTC/PTC potting
  • high temperature component potting
  • heat sink / IC interface thermal compound
  • High thermal conductivity
  • Silicone / non-silicone based material
  • High thermal conductivity epoxy / silicone potting compound


Model no
Description
Characteristic 
Viscosity cPs @25℃
Curing Condition
286A/B
Two component epoxy (white)

2W/mK high thermal conductivity, 1:1 mixing ratio, Mixpac

paste

25℃ 24hrs or 65℃ 2hrs

282A/B
Two component epoxy (Gray)

2W/mK high thermal conductivity, 1:1 mixing ratio, Mixpac

paste

25℃ 24hrs or 65℃ 2hrs

310-01
One component epoxy

4.2W/mK high thermal conductivity, high lap shear, black

200K-300K

150℃ 30mins or125℃ 60mins or reflow

310-01HF
One component epoxy
4.2W/mK high thermal conductivity, high lap shear, black
200K-300K
150℃ 30mins or125℃ 60mins or reflow
310-01GHF
One component epoxy
4.2W/mK high thermal conductivity, high lap shear, black, halogen free
200K-300K
150℃ 30mins or125℃ 60mins or reflow
400-64-1AFR/600-9B
Two component epoxy
UL 94V-0,2.5W/mK high thermal conductivity, Low CTE
60-90k(mixed)
25℃ 16hrs or 65℃ 1hrs
400-64-1AFR/600-11B
Two component epoxy

2.5W/mK high thermal conductivity, low CTE

60K-90K(mixed)

120℃ 30mins

400-64-1AFR/CAT GEL
Two component epoxy
2.5W/mK high thermal conductivity, low hardness, low stress
20K-30K(mixed)
100℃ 3hrs or 125℃ 2hrs
498-11A/B
Two component epoxy
2.4W/mK high thermal conductivity, gray, room temperature curing
10K-15K (mixed)
25℃ 24hrs
498-12A/B
Two component epoxy
2.4W/mK high thermal conductivity, good adhesion, good out-gassing
10K-15K (mixed)

25℃ 24hrs

318-9
Thermal grease (silicone)
Thermal grease (silicone)
paste

CAC-104
Thermal grease (silicone)
0.8W/mK high thermal conductivity
paste

CAC106
Thermal grease (silicone)
2.0W/mK high thermal conductivity
paste

505-61
Thermal grease (non-silicone)
4.5W/mK very high thermal conductivity
paste

CAC105-LV
Thermal grease (non-silicone)
0.8W/mK high thermal conductivity
100K

E-Fill 3300
Two component silicone
1.5W/mK, low cost
6K-9K

80℃ 15mins or 25℃ 8hrs

Applicable to:
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