Emei Group

Emei Group is a supplier of electronic engineering materials and components

Micro-electronic Material

Micro-electronic Material

Micro-electronic Material

Typical applications 
Products 
  • COB bonding
  • Thermally conductive
  • Sealing
  • Under-fill
  • Semi-conductor package
  • Conductive epoxy
  • One / two component epoxy adhesive
  • One component silicone


Model no
Description
Characteristic
Viscosity cPs @25℃
Curing Condition
275-55
Under-fill
Fast curing, reworkable
4K-6K
120℃ 3-4mins
400-58
Surface Mount adhesive
Strong adhesion, instant curing
200K-250K
120℃ 20mins
400-58HF

Halogen free surface mount adhesive

Good adhesion, instant curing
250K-350K
120℃ 20mins
400-97
COB bonding
Good flow, low profile
40K-60K
125℃ 60mins
408-14
COB bonding
Resistance to high temperature and humidity, survive reflow
45K-55K
120℃ 30mins
DA-5100
Die attach conductive epoxy
Good electrical conductivity
Paste
150℃ 30mins
EN-7830
Premium grade COB bonding
Resistance to high temperature and humidity, survive reflow and pressure cooker test
65K-90K
150℃ 30mins
EB-7408
COB bonding
Low temperature curing, good stability upon storage
40K-50K

        

120℃ 30mins


Applicable to:
Product Center