We were founded in 1992 as a Trading Company and distributor of Electronic components. In 1996, we started our fabrication and repacking sub-contracting house in Dongguan. From 2004, we consolidated our name as Emei Group and became a Leading manufacturer and supplier of EMI Gaskets, TIMs, Compounds and Adhesives, Bulk Molding Compounds and Specialty Transformers. We have four Business units with strong R & D and Supporting team in Dongguan, China. We have sales offices and manufacturing facilities in North America, Belgium, Hong Kong, Shanghai, and Taiwan. We have distributors in the USA, Mexico, Europe, the Middle East, and Japan.
        
        
 
					
            
            
            
            
        
                    
                    
                    
        | Typical applications  | Products  | 
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| Model no | Description | Characteristic | Viscosity cPs @25℃ | Curing Condition | 
| 275-55 | Under-fill | Fast curing, reworkable | 4K-6K | 120℃ 3-4mins | 
| 400-58 | Surface Mount adhesive | Strong adhesion, instant curing | 200K-250K | 120℃ 20mins | 
| 400-58HF | Halogen free surface mount adhesive  | Good adhesion, instant curing | 250K-350K | 120℃ 20mins | 
| 400-97 | COB bonding | Good flow, low profile | 40K-60K | 125℃ 60mins | 
| 408-14 | COB bonding | Resistance to high temperature and humidity, survive reflow | 45K-55K | 120℃ 30mins | 
| DA-5100 | Die attach conductive epoxy | Good electrical conductivity | Paste | 150℃ 30mins | 
| EN-7830 | Premium grade COB bonding | Resistance to high temperature and humidity, survive reflow and pressure cooker test | 65K-90K | 150℃ 30mins | 
| EB-7408 | COB bonding | Low temperature curing, good stability upon storage | 40K-50K | 
 120℃ 30mins  |