Emei Group

Emei Group is a supplier of electronic engineering materials and components

Printed Circuit Board Assembly

Printed Circuit Board Assembly

Printed Circuit Board Assembly

Typical applications 
Products 
  • Potting
  • Encapsulation
  • Conformal coating
  • Stencil
  • Surface mount
  • Thermally conductive
  • One / two component epoxy adhesive
  • Silicone / non-silicone based thermal conductive adhesive
  • UV coating
  • Surface mount adhesive


Model no
Description
Characteristic

Viscosity cPs @25℃

Curing Condition
1102
Hot melt
UL 94V-0 certified, halogen and phosphorus free
Available in rod / particle form
150-160℃ (melting point)
282A/B
Two component epoxy adhesive (Gray)
2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac
Paste

25℃ 24hrs or 65℃ 2hrs

286A/B
Two component epoxy adhesive (White)  
2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac
paste

25℃ 24hrs or 65℃ 2hrs

400-58
Surface mount adhesive
Good adhesion, instant curing
200K-250K
120℃ 20mins
500-71
Conformal coating
Low temperature curing
50K-100K
60-70℃ 2hrs
500-71-1
Conformal coating
UV inspection
50K-100K

60-70℃ 2hrs

Applicable to:
Product Center