Emei Group

Emei Group is a supplier of electronic engineering materials and components

Transformer Adhesion & Potting Applications

Transformer Adhesion & Potting Applications

Transformer Adhesion & Potting Applications

Typical applications  Products 
  • Power supply
  • Relay
  • Transformer
  • Thermal sensor
  • Coils
  • IGBTS
  • One / two component epoxy adhesive
  • UL certified two component epoxy potting compound
  • One / two component silicone adhesive
  • Two component PU adhesive


Model no 
Description 
Characteristic 
Viscosity cPs @25℃ 
Curing Condition 
2001A/H-1
Two component epoxy potting compound  
UL-94V0,Room temp cure
5K-8K
25℃ 24hrs
2001A/H-15
Two component epoxy potting compound
High strength, high temperature resistance
5K-8K
80℃ 2hrs + 125℃ 2hrs
2001A/H-16
Two component epoxy potting compound

UL 94V-0 certified, high strength

4K-6K
90℃ 2hrs or 100℃ 1 hrs
2001A-4/600-9B
Two component epoxy potting compound
Low sag, low temperature curing
20K-30K
25℃ 60 mins
2039A/B
Two component epoxy potting compound
Low stress, high dielectric strength
3K-5K
25℃ 24hrs or 70℃ 1-2hrs
2059A/H-1
Two component epoxy potting compound
UL 94V-0 certified, white version of 2001A/H-1
6K-8K
25℃ 24hrs
2059A/H-16
Two component epoxy potting compound
UL 94V-0 certified, white version of 2001A/H-16
5K-7K
60℃ 4hrs
400-34

One component epoxy adhesive

Low hardness, flexible，gray
150K-210k
120℃ 120mins
400-34HF
One component epoxy adhesive
Halogen free version of 400-34, gray
130K-170K
120℃ 135mins
400-36
One component epoxy adhesive
High viscosity adhesive for ferrite cores
Paste

120℃ 45mins

400-34HF
One component epoxy adhesive
Halogen free version of 400-34, gray
130K-170K
120℃ 135mins
400-36
One component epoxy adhesive
High viscosity adhesive for ferrite cores
Paste
120℃ 45mins
400-36LH
One component epoxy adhesive

Halogen free version of 400-36

60K-90K

120℃ 45mins

400-64-1AFR/600-9B
Two component epoxy potting compound
UL 94V-0,2.5W/mK high thermal property, Low CTE
60K-90K
60K-90K
400-64-1AFR/600-11B
Two component epoxy potting compound
UL 94V-0 certified, good thermal conductivity, high temperature curing
60K-90K
120℃ 30mins
400-64-1AFR / CAT-GEL
Two component epoxy potting compound
Thermally conductive, good dielectric strength, low stress
20K-30K
100℃ 3hrs or125℃ 2hrs
505-40A/B
Two component epoxy potting compound
1:1 volumetric mixing ratio, low viscosity
2K-4K
25℃ 12-16hrs
505-59A/B
Two component epoxy potting compound
1:1 volumetric mixing ratio, low hardness, clear
800K-1000K
25℃ 24hrs
505-82A/B
Two component epoxy potting compound
UL 94V-0 certified, 1:1 volumetric mixing ratio
7K-8K
60℃ 2hrs
703-18A/B
Two component epoxy potting compound
Transparent potting compound
300K-600K
60℃ 4 hrs
802-18A/B
Two component epoxy potting compound
1:1 volumetric mixing ratio, low hardness
20K-30K
25℃ 16-24hrs or 65℃ 2-4 hrs
Applicable to:
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