Emei Group

Emei Group is a supplier of electronic engineering materials and components

Circuitry and Contacts Printing

Circuitry and Contacts Printing

Circuitry and Contacts Printing

Typical applications 
Products 
  • For switch circuit
  • Circuit bridging

  • High conductivity
  • Abrasion resistance


Model no 
Description 
Characteristic 
Viscosity cPs @25℃ 
Curing Condition 
CI-2015H
Heat curing carbon ink
Abrasion resistant, low resistance, high viscosity, through hole material
22Ω/□.mil
150℃ 30mins
CI-2015L
Heat curing carbon ink
Low viscosity, to be used with CI-2018H
22Ω/□.mil
150℃ 30mins
CI-2015XL
Resistance adjustment carbon ink
Very low viscosity, to be used with CI-2018H
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DI-529B
Temperature resistant peelable mask
Temperature resistance up to 260℃, easy to peel off
-150℃ 30mins
DI-529R
Temperature resistant peelable mask
Temperature resistance up to 260℃, easy to peel off
-150℃ 30mins
Applicable to:
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